FPGA Processing Utilizing Xilinx ZYNQ FPGA with Integrated I/O

  • Xilinx FPGA ZYNQ XQZ045
  • Integrated Dual core ARM Processor
  • 16GB of DDR-3 Memory
  • 128MB Flash
  • Six Ethernet Ports
  • 20 x RS-482 Transmit
  • 20 x RS-482 Receive
  • 8 x RS-232
  • 3 x CAN Bus
  • 40 x GPIO
  • 2 x isoSPI
  • 3 x USB
  • 5 x Temperature Sensors
  • All I/O routed to the backplane
  • All power generations are redundant
  • Rugged conduction cooled module

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The VT972 is a rugged, conduction cooled module in custom form factor (available conduction cooled only).  The module has a Xilinx ZYNQ XQZ045 with 16GB of DDR-3 Memory.  The module has extensive I/O integrated, which includes:

  • Six Ethernet ports 10/100/1000-Base-T
  • 20 x RS-482 Transmit
  • 20 x RS-482 Receiver
  • 8 x RS-232
  • 3 x CAN Bus
  • 40 x GPIO
  • 3 x USB
  • 5 x Temperature Sensors
  • 128MB Flash
  • 2 x IsoSPI

All I/O are routed to the backplane connector. The module has redundant power generation for each power rail for full redundancy. The backplane connector is an Amphenol Rugged Brushed Contact LRM.

The module comes only in rugged conduction cooled version and operates with input power of 18V-36V DC (typical 24V).

Key Features
  • Xilinx FPGA ZYNQ XQZ045
  • Integrated Dual core ARM Processor
  • 16GB of DDR-3 Memory
  • 128MB Flash
  • Six Ethernet Ports
  • 20 x RS-482 Transmit
  • 20 x RS-482 Receive
  • 8 x RS-232
  • 3 x CAN Bus
  • 40 x GPIO
  • 2 x isoSPI
  • 3 x USB
  • 5 x Temperature Sensors
  • All I/O routed to the backplane
  • All power generations are redundant
  • Rugged conduction cooled module
Benefits
  • Design utilizes proven VadaTech subcomponents and engineering techniques
  • Electrical, mechanical, software, and system-level expertise in house
  • Full system supply from industry leader
  • AS9100 and ISO9001 certified company
Specifications
Specifications

Block diagram

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