VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC549. The AMC549 is SOFI carrier that allows any of the VadaTech SOFI module to interface with the high speed UltraScale+™ XCVU13P FPGA. The module has a second tongue which allows addition x16 SERDES routed to the backplane.

The unit has an onboard, re-configurable UltraScale+™ XCVU13P FPGA that directly interfaces with high speed ADC/DAC and a single bank of DDR4 memory channels (64-bit wide for a total of 8 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.

The AMC549 8 HP panel size will occupy two mid-size slots within a chassis and is available for conduction cooled options. Please consult with VadaTech Sales to discuss specific ordering options.

List of SOFI Modules: A/D & D/A (vadatech.com)

About VadaTech

VadaTech provides innovative embedded computing solutions from board-level products, chassis -level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA, VPX and PCIe solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific.