VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers chassis and modules that are compliant to the MicroTCA.1 specification for air-cooled rugged applications.
The MicroTCA.1 specification utilizes an enhanced retention screw to hold the modules in place for rugged environments. It defines a maximum operating shock of 25g and 8g of random vibration. The first in the line of VadaTech‘s MicroTCA.1 subrack products is the VT930 subrack. The 3U high subrack features up to 12 AMC slots, including up to 6 full-size (6HP) and 6 mid-size (4HP) modules. With perforated top and bottom covers, the subrack chassis is cooled from an external fan tray below the card cage. The passive backplane in the VT930 is 40GbE capable with dual MicroTCA Carrier Hub (MCH) slots and dual Power Module (PM) slots.
VadaTech also offers modules in the MicroTCA.1 format, which require a latching screw for retention and stability. Most of VadaTech’s 250+ Advanced Mezzanine Card (AMC) modules for MicroTCA can be easily modified by the company to meet the rugged specification.
VadaTech also provides hardened chassis and modules in the MicroTCA.3 format (conduction cooled). The company offers the full ecosystem of MicroTCA products including chassis platforms, MCHs, power modules, AMCs, and specialty/test products.