Description

SOFI Module ConceptThe Serial Optimized FPGA Interface (SOFI) module concept is proprietary to VadaTech. It supports rapid product development but is not intended for field interoperability. Key characteristics of this approach are as follows:

• Makes use of FMC physical form factor but is not compatible with FMC carriers.Re-purposes pins on the mezzanine interface connector to support many more SERDES connections. This allows the mezzanine to provide more ADC/DAC with JESD connections to the FPGA.
• Achieves higher SERDES count without the need for secondary connector, so making it suitable on compact form factor products (e.g. AMCs and 3U VPX modules).
• The SOFI module concept can be used in conduction cooled products.
• Some SOFI modules include a daughter-card assembly for even higher performance density. Such modules may be limited in temperature range supported. Check with VadaTech sales for details.
• SOFI modules are compatible with SOFI carriers in various form factors, allowing rapid porting of designs from commercial to mil/aero products.

Each combination of SOFI module and carrier requires engineering development in thermal design, board support package and reference design firmware. This datasheet summarizes the SOFI/carrier combinations currently available. Contact your local VadaTech sales team for the latest information if a required combination is not listed here.